14 June 2019
The 12th International Congress on Thermal Stresses (TS2019) was held in Hangzhou from 1 June to 4 June, 2019. The congress was jointly held by Zhejiang University, International Society of Thermal Stresses (ISTS), Chinese Society of Theoretical and Applied Mechanics (CSTAM), and was organized by Institute of Applied Mechanics in ZJU. International Union of Theoretical and Applied Mechanics (IUTAM) and National Natural Science Foundation of China (NSFC) also provided great support to this event. Prof. Chen Weiqiu from Zhejiang University is the chairman of the congress, and Prof. Richard B. Hetnarski from Rochester Institute of Technology, and Prof. Naotake Noda from Shizuoka University are co-chairmen of the congress.
The conference aims to provide a platform for scholars, engineers and graduate students engaged in thermal stress analysis worldwide to share their research results, to exchange ideas, and to seek for cooperation. The conference received 133 abstracts and 62 papers from 16 countries and regions, including China, the United States, Japan, Russia, Poland, Sweden, India, Italy, Tunisia, Ukraine, Hong Kong and Taiwan. More than 140 delegates attended the meeting, including 48 from overseas.
The opening ceremony was held on 2 June, hosted by the conference secretary Prof. Song Jizhou from Zhejiang University. Prof. Naotake Noda from Shizuoka University, Prof. Gao Cunfa from Nanjing University of Aeronautics and Astronautics, Prof. Qu Shaoxing and Prof. Chen Weiqiu from Zhejiang University delivered speeches at the opening ceremony. After the ceremony, six scholars from different universities gave keynote reports respectively. Reports topics were: Major challenges for thermal protection structures—thermal stress and high temperature strength (Academician Fang Daining, BIT), Analytical characteristics of strain gradient theory in three green-naghdi models of chiral Cosserat thermoelastic materials (Prof. Moncef Aouadi, University of Carthage, Tunisia), Thermal-magneto-acoustic radiation of unsupported nanofilm (Prof. Lin Zhihua, City University of Hong Kong), Simulation of thermal stress in low-alloy steel (Prof. Lars-Erik Lindgren, Lulea University of Technology, Sweden), Monitoring of three-dimensional transient temperature field and thermal stress in pressure elements based on wall temperature measurement (Prof. Jan Taler, Krakow University of Technology, Poland), Progress in model reduction calculation for dynamic problems of thermal structures with multiple subdomains (Prof. Kumma K. Tamma, University of Minnesota, USA). The conference has 17 sub-sessions with a total of 124 oral presentations.
Participants went to Zijingang campus to visit the History Museum of Zhejiang University and some related laboratories on the afternoon of 4th June. The conference ended successfully on the morning of 5th June.
Professor Naotake Noda from Shizuoka University, founder of the International Thermal Stress Conference, delivered a speech on the opening ceremony.
Professor Gao Cunfa, leader of Electronic Electromagnetic Device Mechanics Working Group of Chinese Mechanics Society, delivered a speech on opening ceremony.
Professor Qu Shaoxing, vice dean of School of Aeronautics and Astronautics from Zhejiang University, delivered a speech on opening ceremony.
Professor Chen Weiqiu, chairman of the conference, delivered a speech on the opening ceremony.
Professor Martin Ostoja-Starzewski from UIUC, editor-in-chief of Journal of Thermal Stresses, presented the honorary certificate to professor Vincenzo Tibullo from the University of Salerno, the organizer of last conference.
Conference Scene
Visit to Zjijingang Campus, Zhejiang University
Group Photo
