INTRODUCTION
The institute is mainly engaged in the research of mainstream semiconductor field such as GaAs/GaN, CMOS and others, covering the analysis and design of microwave millimeter-wave radiofrequency MMIC and RFIC chip circuit, as well as the device modeling and testing technology, high density integration and packaging technology, which well serves satellite navigation, radar, communication, etc. So far, the institute has built four technology platforms that are high-performance parallel simulation computation, chip modeling and testing, high-density integrated micro assembly and packaging, and integrated testing of electrical property and reliability. These techniques and facilities well support the research of microwave millimeter-wave radiofrequency chips, CMOS mixed-signal chips, high-density integration components and packaging technology. And the former techniques is currently in the leading position in China.
Institute Website: http://iaee.zju.edu.cn/
RESEARCH AREAS
Research on CMOS radio frequency and digital-mode hybrid chip technology
Research on high density integrated components and packaging technology
Modern signal and information processing technology
Research on gallium arsenide/gallium nitride microwave millimeter-wave radio frequency chip technology
This research field includes core modeling technology, on-chip power management technology, high-efficiency micro-power synthesis technology, matching technology, high yield optimization design technology, on-chip thermal design technology, high-reliable long-life design technology. The development of micro, high performance and high integration microwave millimeter-wave radio frequency T/R sleeve for L, X, K, Ka and other wavebands, which have been widely used in radar, communications, navigation and other fields.
Research on CMOS radio frequency and digital-mode hybrid chip technology
The research focuses on the design technology of ultra-low power consumption, technology of frequency synthesizer, low noise amplifier and amplifier technology, technology of mixer, filter technology and power management technology.
Research on high density integrated components and packaging technology
This research field mainly focuses on component miniaturization technology, high frequency packaging technology, component thermal design technology, low cost packaging technology, etc.
Modern signal and information processing technology
This research field includes digital signal acquisition and processing, FPGA design technology, digital image information extraction and processing technology.
